White Mountain Labs - ESD and ATE Test Services

White Mountain Labs and FlipChip International Announce Turnkey Business Offering Using Eagle Test ETS364 Platform

PHOENIX (September 10, 2007) - FlipChip International (FCI), the leading merchant flip chip and wafer level package provider, and White Mountain Labs (WML), the innovative leader in test and characterization of advanced technologies, announced today an alliance to offer turnkey services for flip chip and wafer-level packaging using Eagle Test Systems' ETS364 Test Platform.

“Flip chip and wafer level packaging are the fastest growing technologies in the packaging industry,” said Bruce Bowers, Vice President of Business Development for FCI. “Customers that are in markets where high performance and space reduction are necessities will be delighted to find a domestic turnkey supplier for their bumping, electrical test, and reduced die service needs.”

FlipChip International provides complete turnkey processing services, including bumping, wafer thinning, backside coat and laser marking, electrical testing, dicing, taping and reeling at its facility in Phoenix. Additionally, FCMS, a joint venture company between FCI and Millennium Microtech, will also offer turnkey processing services at its facility in Shanghai, China.

White Mountain Labs ClearTest ATE Services will operate as a development, characterization and production test facility for FCI customers who require test solution development and data analysis in prompt timeframes. Utilizing a highly experienced team of test engineers, WML can provide the test solution development and production test for the variety of electronic components and devices developed by FCI customers.

“We received a tremendous response from customers who were looking for Eagle characterization and development abilities,” said John McCaffrey, Vice President of New Business Development at White Mountain Labs. “We are confident that the next logical step is to join forces with FlipChip International to provide their customers with production test support both within the U.S. and globally, as needed.”

“As a leader in the manufacturing of power-analog and precision mixed-signal automated test equipment, we are confident that the collaboration between FlipChip International and White Mountain Labs will offer Eagle customers of all sizes, a valuable single source for test services from first silicon through production,” added Dan Faia, VP North American Sales, Eagle Test Systems, Inc.

About White Mountain Labs

White Mountain Labs was founded in December 1999 based on the conviction that a systematic approach to highly technical, “niche” semiconductor testing could produce clear data, enabling engineers to be successful in developing innovative products. White Mountain Labs started as a prototype lab system for test and characterization of Electrostatic Discharge (ESD) and Latch-up in Integrated Circuits and has since expanded into ATE (Automated Test Equipment) test engineering services. More than 5,000 projects have been successfully completed for more than 100 semiconductor companies in the past 7 years, including numerous customers in the UK, Europe and Israel. White Mountain Labs is an ISO17025 accredited ESD and Latch-up test facility performing testing to standards prescribed by the ESD Association, JEDEC, Mil-Std and the Automotive Electronics Council (AEC).

About FlipChip International

FlipChip International, LLC is a privately held supplier of products and services for the wafer bumping and wafer scale packaging semiconductor market. FlipChip International, LLC is a wholly owned subsidiary of RoseStreet Labs LLC, a supplier of products and services for wireless infrastructure in the renewable energy, semiconductor, life science and homeland security markets. Please visit http://www.flipchip.com.

About Eagle Test Systems

Eagle Test Systems, Inc. (Nasdaq: EGLT) designs, manufactures, sells and services high-performance automated test equipment for the semiconductor industry. The company's products are used to test analog, mixed-signal and radio frequency (RF) semiconductors that are used in products such as digital cameras, MP3 players, automotive electronics, cellular telephones, computers and peripherals. The company was founded in 1976 and has offices located throughout the world in Asia, North America and Europe, with corporate headquarters in Buffalo Grove, Illinois. Please visit http://www.eagletest.com for more information.

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